Flexdym Polymer Starter Pack聚合物入門包

達(dá)爾文微流體
Flexdym聚合物入門包-PDMS的替代品
沒有評論添加您的評論
1周內(nèi)可用
類別：電泳和電化學(xué)芯片，微細(xì)加工，微流體液滴發(fā)生器，微流體流通池，微混合器芯片
嘗試用此現(xiàn)成的入門包試用我們?nèi)碌纳锵嗳菪跃酆衔铮?Flexdym是PDMS的替代品：自密封，耐腐蝕，經(jīng)濟(jì)高效且具有生物相容性，在制造芯片時(shí)將大大簡化您的工作。 包含10張15 x 15厘米Flexdym聚合物。

在該套件中，您可以嘗試用10張15 x 15厘米的Flexdym芯片代替PDMS進(jìn)行芯片微細(xì)加工?？筛鶕?jù)要求提供不同的厚度：1.3 mm，0.8 mm和0.2 mm。
 

Flexdym聚合物是微流控技術(shù)的真正突破

特點(diǎn)與優(yōu)勢
Flexdym是一種新型聚合物，它具有PDMS的優(yōu)點(diǎn)而*：

生物相容性（ISO 10993-5和UPS Class VI）
在環(huán)境溫度下自密封：無需使用等離子鍵合或高溫，然后可以在組裝前添加生物材料
高性價(jià)比
兼容光學(xué)檢測：低熒光，光學(xué)透明
無吸收，可滲透氣體，不滲透液體
耐撕裂：與PDMS不同，操作時(shí)不會(huì)撕裂
有效整合細(xì)胞和生物試劑
Flexdym的高密封性能可在組裝之前整合細(xì)胞，蛋白質(zhì)和其他酶生物材料。通過不涉及等離子體，真空或高溫的制造工藝，我們可以確保生物制劑在您的設(shè)備中保持活力和功能。

快速微細(xì)加工
使用熱壓花系統(tǒng)成型
低壓：低于1巴
無需真空
容易脫模
完整操作不到一分鐘
極低的粘度，可用于快速熱成型，填充率比傳統(tǒng)的剛性熱塑性塑料（COC，PS，PMMA等）高100-1000倍
應(yīng)用領(lǐng)域
在微流控芯片的經(jīng)典應(yīng)用中，F(xiàn)lexdym是任何其他芯片材料的替代品。

0.250 mm和0.750 mm是合適的，主要用于膜的制造
1.2 mm和2 mm更易于成型，適合Flexdym初學(xué)者制造微流控芯片
這種聚合物在生命科學(xué)中特別有趣：其生物相容性使設(shè)計(jì)任何實(shí)驗(yàn)變得簡單。自密封技術(shù)不具有破壞性，與其他芯片密封中使用的等離子體，真空或高溫不同。

芯片中的光學(xué)或熒光測量需要使用主要在紫外線和可見光范圍內(nèi)具有高透明度（幾乎90％的透射率）的材料。 Flexdym滿足這些條件。實(shí)際上，它在295 nm波長下達(dá)到了50％透射率的極限（我們認(rèn)為這是可接受的透明度極限）。 Flexdym具有與透明的材料相似的特性。對于許多熒光團(tuán)，尤其是受歡迎的熒光Cy3和Cy5染料，此透明窗口足夠?qū)挘鼈兊募ぐl(fā)波長分別為550和650 nm，發(fā)射波長分別為570和670 nm。

主要特征
Flexdym紙尺寸150 x 150 mm
厚度200微米/ 750微米/ 1.3毫米
撕裂強(qiáng)度15 kN / m
拉伸強(qiáng)度7.6 kN / m
伸長率720％
成型溫度115-185°C
自密封和快速粘合
成型后，F(xiàn)lexdym易于粘合到Flexdym或玻璃上。

粘合溫度Flexdym芯片在玻璃上的Flexdym芯片在玻璃上
室溫600 mbar 400 mbar
85°C 5.5巴720毫巴

Flexdym Polymer Starter Pack聚合物入門包

Darwin Microfluidics
Flexdym Polymer Starter Pack - alternative to PDMS
No reviewsAdd Your Review
Available within 1 week
Category: Electrophoresis & Electrochemistry Chips, Microfabrication, Microfluidic Droplet Generators, Microfluidic Flow Cells, Micromixers Chips
Try our brand new biocompatible polymer with this ready-to-fabricate start pack! The Flexdym is a great alternative to PDMS: self-sealing, resistant, cost-effective and biocompatible, it will greatly ease your work when fabricating chips. Contains 10 sheets of 15 x 15 cm Flexdym polymer.

In this kit, you will be able to try the Flexdym with 10 sheets of 15 x 15 cm as an alternative to PDMS for your chip microfabrication. Different thicknesses are available upon request: 1.3 mm, 0.8 mm and 0.2 mm.
 

The Flexdym polymer is a real breakthrough for microfluidics

Features & Benefits
The Flexdym is a new polymer which gathers the advantages of PDMS without its drawbacks:

Biocompatible (ISO 10993-5 & UPS Class VI)
Self-sealing at ambient temperature: no need to use plasma bonding or high temperatures, you can then add biomaterials prior assembly
Cost-effective
Compatible for optical assays: low fluorescence, optically clear
No absorption, permeable to gas and not to liquid
Resistant to tearing: Unlike PDMS, it will not tear apart when you manipulate it
Effective integration, cellular and bio-reagents 
The high sealing performances of the Flexdym enable the integration of cells, proteins and others enzymes biomaterials prior to assembly. With a fabrication process that doesn’t involve plasma, vacuum or high-temperature, we can ensure that biological agents remain viable and functional in your device.

Fast microfabrication
Molding with a hot-embossing system
Low pressure: below 1 bar
No vacuum needed
Easy unmolding
Full operation takes less than a minute
Extremely low viscosity for rapid thermal molding with filling rates up to 100-1000 times greater than classical rigid thermoplastics (COC, PS, PMMA,…)
Applications
Flexdym is an alternative to any other chip material in the classical applications of microfluidic chips.

0.250 mm and 0.750 mm are suitable and mostly used for the fabrication of membranes
1.2 mm and 2 mm are easier to mold and suitable for Flexdym beginners in the fabrication of microfluidic chips
This polymer is particularly interesting in life sciences: its biocompatibility make it simple to design any experiment. The self-sealing technology is not destructive, unlike plasma, vacuum or high temperature used in the sealing of other chips.

Optical or fluorescence measurements in a chip require the use of materials that show a high level of transparency (almost 90% transmittance), primarily in the UV and visible range. Flexdym fulfills these conditions. Indeed, it reaches the limit of 50% transmittance (which we considered to be an acceptable limit in transparency) at a wavelength of 295 nm. Flexdym features similar properties to the clearest materials. This transparency window is sufficiently wide for a large number of fluorophores, particularly the most popular fluorescent Cy3 and Cy5 dyes, which have excitation wavelengths at 550 and 650 nm and emission wavelengths at 570 and 670 nm, respectively.